seeed studio reSpeaker Flex XVF3800 Circular-4 with XIAO ESP32S3 Pre-Soldered XIAO ESP32S3, 360° 4-Mic Array with AEC, Beamforming and I2S Audio for Robotics and Voice AI

• 360° Omnidirectional Voice Capture: Four PDM MEMS microphones in a circular array with 44 mm spacing capture sound from around the device. Well suited for mobile robots, voice-enabled devices, smart displays and interactive terminals.
• XMOS XVF3800 Voice Processing: Onboard AEC, AGC, DoA, multi-channel beamforming, VAD, noise suppression and dereverberation help capture clearer far-field speech in noisy, echo-prone environments.
• Pre-Soldered XIAO ESP32S3: The onboard XIAO ESP32S3 adds Wi-Fi and Bluetooth connectivity, with I2S audio and I2C control wired directly to the XVF3800 for wireless voice interfaces, embedded AI devices and connected robotics.
• Split-Board Design: Position the circular microphone array at the top or center of an enclosure while placing the core board elsewhere. The included 20 cm, 24-pin FPC ribbon cable connects the two boards for flexible installation.
• Flexible Embedded and USB Integration: Use I2S with the pre-soldered XIAO ESP32S3 for embedded voice and robotics projects, or USB UAC 2.0 with compatible firmware for PCs and SBCs. USB-C and locking PH2.0 connections support flexible deployment, while a 3.5 mm AUX output and an onboard amplifier with an external speaker connector provide versatile playback options. No speaker is built in.

Designed for developers building voice interfaces that require all-around pickup, the reSpeaker Flex XVF3800 Circular-4 with XIAO ESP32S3 combines 360° voice capture, onboard audio processing and wireless MCU control in a flexible open-board platform. It is well suited for mobile robots, voice-enabled devices, smart displays, embedded AI systems and interactive terminals where users may speak from different directions. The circular array features four PDM MEMS microphones with 44 mm spacing for 360° omnidirectional voice capture. The microphone board is separated from the XVF3800 core board and connected by the included 20 cm, 24-pin FPC ribbon cable, allowing both boards to be positioned independently inside a product enclosure. Powered by the XMOS XVF3800, the system provides AEC, AGC, DoA, multi-channel beamforming, VAD, noise suppression and dereverberation to support clearer far-field voice capture in noisy and echo-prone environments. The pre-soldered XIAO ESP32S3 adds Wi-Fi and Bluetooth connectivity, with I2S audio streaming and I2C control wired directly to the XVF3800. This version typically ships with I2S firmware for embedded development, while USB UAC 2.0 operation is available with compatible USB firmware. USB and I2S operate as separate modes. For system integration, the core board provides USB-C and locking PH2.0 connectivity, a 3.5 mm AUX output and a connector for an external speaker. This is an open-board development platform; no enclosure or built-in speaker is included.